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Technical Specifications
NXP MC33390DR2 technical specifications.
General
| Package/Case | SOIC |
| Data Rate | 10.4Kbps |
| Lead Free | Contains Lead |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Receiver Hysteresis | 200mV |
| RoHS Compliant | No |
| Simplex/Duplex | Half Duplex |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC33390DR2 Datasheet
Download the complete datasheet for NXP MC33390DR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.