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Technical Specifications
NXP MC3361BDR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
9.9
Package Width (mm)
3.9
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC3361BDR2 Datasheet
Download the complete datasheet for NXP MC3361BDR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.