Quick Jump:
Technical Specifications
NXP MC33879APEKR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 11.1(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC33879APEKR2 Datasheet
Download the complete datasheet for NXP MC33879APEKR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.