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Technical Specifications
NXP MC33879TEK technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
11.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.35(Max)
Seated Plane Height (mm)
2.45(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC33879TEK Datasheet
Download the complete datasheet for NXP MC33879TEK to view detailed technical specifications.
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