High-speed CAN physical interface integrates a 5.0 V supply for the CAN bus transceiver and operates from a single battery connection. The interface supports 40 kb/s to 1.0 Mb/s CAN communication and is compatible with the ISO11898 standard. Four operating modes include low-power modes with remote CAN wake-up and local wake-up recognition. Logic I/O is compatible with 2.75 V to 5.5 V controller interfaces, and an EF-suffix 14 SOIC version is specified for -40 °C to 125 °C ambient operation with Pb-free packaging.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the NXP MC33902 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Device function | High-speed CAN physical interface |
| Integrated CAN transceiver supply | 5.0V |
| CAN baud rate | 40 to 1000kb/s |
| CAN standard compatibility | ISO11898 |
| Supply configuration | Single battery supply |
| Logic I/O voltage range | 2.75 to 5.5V |
| Logic interface compatibility | 3.3 or 5.0V |
| Operating modes | 4 |
| Wake-up support | Remote CAN wake-up and local wake-up recognition |
| Diagnostics | CAN bus failure, TXD/RXD pin monitoring, cold-start detection, wake-up source reporting |
| Enhanced diagnostics interface | Pseudo SPI via EN, STBY and RR terminals |
| Bus stabilization terminal | Split terminal for bus recessive level stabilization |
| INH output function | External voltage regulator control |
| Ambient operating temperature | -40 to 125°C |
| Package | 14 SOIC |
Download the complete datasheet for NXP MC33902 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
These are design resources that include the NXP MC33902
Hardware design guide for NXP MPC574xP microcontrollers, covering power supplies, clock circuitry, reset configurations, debug interfaces, and automotive communication modules.