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Technical Specifications
NXP MC33993DWBR2 technical specifications.
General
| Package/Case | SOIC |
| Interface | SPI, Serial |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Weight | 0.01799oz |
Compliance
| RoHS | Not CompliantNo |
Datasheet
NXP MC33993DWBR2 Datasheet
Download the complete datasheet for NXP MC33993DWBR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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