96-segment LED driver IC for surface mount applications. Features a 24-pin QFN EP package with exposed pad, measuring 4x4x0.65mm with a 0.5mm pin pitch. Operates with a supply voltage range of 5V to 21V, drawing a maximum supply current of 6500uA. Delivers an output voltage from 8V to 60V and a low-level output current of 30600uA. Suitable for operation between -40°C and 85°C.
PackageQFN EP
MountingSurface Mount
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Technical Specifications
NXP MC34845BEPR2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4
Package Width (mm)
4
Package Height (mm)
0.65
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-243WGGD
Number of Segments
96
Low Level Output Current
30600uA
Output Voltage
8 to 60V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
21V
Maximum Power Dissipation
3400mW
Maximum Supply Current
6500uA
Min Operating Supply Voltage
5V
Typical Operating Supply Voltage
10V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC34845BEPR2 Datasheet
Download the complete datasheet for NXP MC34845BEPR2 to view detailed technical specifications.
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