96-segment LED driver IC for surface mount applications. Features a 24-pin QFN EP package with exposed pad, measuring 4x4x0.65mm with a 0.5mm pin pitch. Operates with a supply voltage range of 5V to 21V, drawing a maximum supply current of 6500uA. Delivers an output voltage from 8V to 60V and a low-level output current of 30600uA. Suitable for operation between -40°C and 85°C.
PackageQFN EP
MountingSurface Mount
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Technical Specifications
NXP MC34845BEPR2 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | QFN EP |
| Package Description | Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 4 |
| Package Width (mm) | 4 |
| Package Height (mm) | 0.65 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-243WGGD |
| Number of Segments | 96 |
| Low Level Output Current | 30600uA |
| Output Voltage | 8 to 60V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 21V |
| Maximum Power Dissipation | 3400mW |
| Maximum Supply Current | 6500uA |
| Min Operating Supply Voltage | 5V |
| Typical Operating Supply Voltage | 10V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC34845BEPR2 Datasheet
Download the complete datasheet for NXP MC34845BEPR2 to view detailed technical specifications.
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