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Technical Specifications
NXP MC56F8167VVFE technical specifications.
General
| Package/Case | BGA |
| Data Bus Width | 16b |
| Halogen Free | Halogen Free |
| Interface | SPI, SCI, EBI/EMI |
| Lead Free | Lead Free |
| Max Frequency | 40MHz |
| Max Operating Temperature | 105°C |
| Memory Size | 512KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 76 |
| Oscillator Type | External |
| Package Quantity | 126 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| RAM Size | 32KB |
| RoHS Compliant | Yes |
| Series | 56F8xxx |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC56F8167VVFE Datasheet
Download the complete datasheet for NXP MC56F8167VVFE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.