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Technical Specifications
NXP MC68000P12 technical specifications.
General
| PTI | NBZZ |
| Material Type | Tested Packaged Device |
| Life Cycle Description (code) | REMOVED FROM ACTIVE PORTFOLIO |
| Status | No Longer Manufactured |
| Tape & Reel | No |
| Exempt from Minimum Delivery Value | Yes |
| Export Control Classification Number (US) | EAR99 |
| CCATS Document | - |
| ENC Status | - |
| Other Trade Compliance Documents | - |
| Budgetary Price excluding tax(US$) | - |
| Change Currency | Order |
| Product/Process Change Notice (PCN) Number | 5446 |
| Product/Process Change Notice (PCN) Type | Product Change Notice |
| Product/Process Change Notice (PCN) Title | POLY-METAL INTER LEVEL DIELECTRIC CHANGE |
| Product/Process Change Notice (PCN) Issue Date | 30 Mar 2000 |
| Product/Process Change Notice (PCN) Effectivity Date | 09 Jul 2000 |
| Sample Exception Availability | N |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP MC68000P12 Datasheet
Download the complete datasheet for NXP MC68000P12 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.