Frequency25MHz
PackagePGA
MountingThrough Hole
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Technical Specifications
NXP MC68302RC25C technical specifications.
General
Package/Case
PGA
Core Architecture
Coldfire
Data Bus Width
32b
Frequency
25MHz
Halogen Free
Halogen Free
Lead Free
Contains Lead
Max Frequency
25MHz
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Mount
Through Hole
Number of Cores
1
Operating Supply Voltage
5V
Package Quantity
14
Packaging
Tray
Radiation Hardening
No
RAM Size
1152B
RoHS Compliant
Yes
Series
M683xx
Weight
0.483253oz
Compliance
RoHS
Compliant
Datasheet
NXP MC68302RC25C Datasheet
Download the complete datasheet for NXP MC68302RC25C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.