8-bit CISC microprocessor, M6800 family, operating at a maximum speed of 2 MHz. Features a single CPU core and supports multiply-accumulate operations. Housed in a 40-pin Ceramic Dual In Line Package (CDIP) for through-hole mounting, with package dimensions of 53.24mm (L) x 15.49mm (W) x 4.57mm (H). Operates within a temperature range of 0°C to 70°C.
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NXP MC68B09ES technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 53.24(Max) |
| Package Width (mm) | 15.49(Max) |
| Package Height (mm) | 4.57(Max) |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Family Name | M6800 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum Speed | 2MHz |
| Number of CPU Cores | 1 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Multiply Accumulate | Yes |
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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