8-bit CISC microprocessor, M6800 family, operating at a maximum speed of 2 MHz. Features a single CPU core and supports multiply-accumulate operations. Housed in a 40-pin Ceramic Dual In Line Package (CDIP) for through-hole mounting, with package dimensions of 53.24mm (L) x 15.49mm (W) x 4.57mm (H). Operates within a temperature range of 0°C to 70°C.
PackageCDIP
MountingThrough Hole
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Technical Specifications
NXP MC68B09ES technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
40
PCB
40
Package Length (mm)
53.24(Max)
Package Width (mm)
15.49(Max)
Package Height (mm)
4.57(Max)
Package Material
Ceramic
Mounting
Through Hole
Family Name
M6800
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum Speed
2MHz
Number of CPU Cores
1
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68B09ES Datasheet
Download the complete datasheet for NXP MC68B09ES to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.