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NXP MC68EC030RP25 technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | PGA |
| Package/Case | PGA |
| Package Description | Plastic Pin Grid Array |
| Lead Shape | Through Hole |
| Pin Count | 132 |
| PCB | 132 |
| Package Length (mm) | 35.05(Max) |
| Package Width (mm) | 35.05(Max) |
| Package Height (mm) | 3.81(Max) |
| Seated Plane Height (mm) | 3.81(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Family Name | MC68030 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Speed | 25MHz |
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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