PackagePGA
MountingThrough Hole
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Technical Specifications
NXP MC68EC030RP25 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
PGA
Package/Case
PGA
Package Description
Plastic Pin Grid Array
Lead Shape
Through Hole
Pin Count
132
PCB
132
Package Length (mm)
35.05(Max)
Package Width (mm)
35.05(Max)
Package Height (mm)
3.81(Max)
Seated Plane Height (mm)
3.81(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Family Name
MC68030
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Speed
25MHz
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68EC030RP25 Datasheet
Download the complete datasheet for NXP MC68EC030RP25 to view detailed technical specifications.
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