32-bit RISC microprocessor featuring a ColdFire device core and HCMOS process technology. Operates at a maximum speed of 25 MHz with a 4KB instruction cache and 4KB data cache. Includes multiply accumulate functionality. Housed in a 179-pin PGA package with through-hole mounting, measuring 47.75mm x 47.75mm x 3.56mm with a 2.54mm pin pitch. Suitable for operation between 0°C and 70°C.
PackagePGA
MountingThrough Hole
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Technical Specifications
NXP MC68EC040RC25 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
PGA
Package/Case
PGA
Package Description
Plastic Pin Grid Array
Lead Shape
Through Hole
Pin Count
179
PCB
179
Package Length (mm)
47.75
Package Width (mm)
47.75
Package Height (mm)
3.56
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Family Name
M68000
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
25MHz
Process Technology
HCMOS
Number of CPU Cores
1
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Instruction Cache Size
4KB
Data Cache Size
4KB
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68EC040RC25 Datasheet
Download the complete datasheet for NXP MC68EC040RC25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.