32-bit RISC microprocessor featuring a ColdFire device core and HCMOS process technology. Operates at a maximum speed of 25 MHz with a 4KB instruction cache and 4KB data cache. Includes multiply accumulate functionality. Housed in a 179-pin PGA package with through-hole mounting, measuring 47.75mm x 47.75mm x 3.56mm with a 2.54mm pin pitch. Suitable for operation between 0°C and 70°C.
Sign in to ask questions about the NXP MC68EC040RC25 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP MC68EC040RC25 technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | PGA |
| Package/Case | PGA |
| Package Description | Plastic Pin Grid Array |
| Lead Shape | Through Hole |
| Pin Count | 179 |
| PCB | 179 |
| Package Length (mm) | 47.75 |
| Package Width (mm) | 47.75 |
| Package Height (mm) | 3.56 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Family Name | M68000 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 25MHz |
| Process Technology | HCMOS |
| Number of CPU Cores | 1 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Instruction Cache Size | 4KB |
| Data Cache Size | 4KB |
| Multiply Accumulate | Yes |
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for NXP MC68EC040RC25 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
