Frequency33MHz
PackagePGA
MountingThrough Hole
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Technical Specifications
NXP MC68EN360RC33L technical specifications.
General
Package/Case
PGA
Core Architecture
Coldfire
Data Bus Width
32b
Frequency
33MHz
Halogen Free
Halogen Free
Interface
Serial, Parallel, Ethernet, UART
Lead Free
Contains Lead
Max Frequency
33MHz
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Max Supply Voltage
5.25V
Min Supply Voltage
4.75V
Mount
Through Hole
Number of Cores
1
Operating Supply Voltage
5V
Package Quantity
10
Packaging
Tray
Radiation Hardening
No
RAM Size
2.5KB
RoHS Compliant
Yes
Series
M683xx
Weight
1.05049oz
Compliance
RoHS
Compliant
Datasheet
NXP MC68EN360RC33L Datasheet
Download the complete datasheet for NXP MC68EN360RC33L to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.