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Technical Specifications
NXP MC68HC000CEI10 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | LCC |
| Package/Case | PLCC |
| Package Description | Plastic Leaded Chip Carrier |
| Lead Shape | J-Lead |
| Pin Count | 68 |
| PCB | 68 |
| Package Length (mm) | 24.29(Max) |
| Package Width (mm) | 24.29(Max) |
| Package Height (mm) | 3.38(Min) |
| Seated Plane Height (mm) | 4.57(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | ColdFire M68000 Processor |
| Data Bus Width | 16|32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 10MHz |
| Number of CPU Cores | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC68HC000CEI10 Datasheet
Download the complete datasheet for NXP MC68HC000CEI10 to view detailed technical specifications.
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