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Technical Specifications
NXP MC68HC11A1MFNE technical specifications.
General
Access Time
3us
Package/Case
PLCC
Data Bus Width
8b
Interface
SPI, SCI
Lead Free
Lead Free
Max Operating Temperature
125°C
Memory Size
512B
Memory Type
EPROM, , ROMless
Min Operating Temperature
-40°C
Number of I/Os
38
Number of Programmable I/O
22
Oscillator Type
External
Packaging
Rail/Tube
Peripherals
POR, WDT
RAM Size
256B
Series
HC11
Compliance
RoHS
Compliant
Datasheet
NXP MC68HC11A1MFNE Datasheet
Download the complete datasheet for NXP MC68HC11A1MFNE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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