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Technical Specifications
NXP MC68HC11F1CPU4 technical specifications.
General
Access Time
4us
Package/Case
LQFP
Halogen Free
Not Halogen Free
Interface
SPI, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of I/Os
30
Oscillator Type
Internal
Package Quantity
90
Packaging
Tray
Peripherals
POR, WDT
RAM Size
1024B
RoHS Compliant
No
Series
HC11
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC11F1CPU4 Datasheet
Download the complete datasheet for NXP MC68HC11F1CPU4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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