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Technical Specifications
NXP MC68HC908AB32MPB technical specifications.
General
Access Time
8us
Package/Case
LQFP
Core Architecture
HC08
Interface
SPI, SCI
Lead Free
Contains Lead
Max Operating Temperature
125°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
51
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM
RAM Size
1024B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908AB32MPB Datasheet
Download the complete datasheet for NXP MC68HC908AB32MPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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