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Technical Specifications
NXP MC68HC908AP32CB technical specifications.
General
Access Time
8us
Package/Case
SDIP
Core Architecture
HC08
Interface
I2C, SPI, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
32
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
2048B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908AP32CB Datasheet
Download the complete datasheet for NXP MC68HC908AP32CB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.