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Technical Specifications
NXP MC68HC908GP32CP technical specifications.
General
Access Time
8us
Address Bus Width
8b
Package/Case
DIP
Core Architecture
HC08
Density
32KB
Halogen Free
Not Halogen Free
Interface
SPI, SCI
Lead Free
Contains Lead
Max Frequency
8MHz
Max Operating Temperature
85°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of ADC Channels
8
Number of I/Os
33
Number of Timers/Counters
2
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
512B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908GP32CP Datasheet
Download the complete datasheet for NXP MC68HC908GP32CP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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