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Technical Specifications
NXP MC68HC908GR8CDW technical specifications.
General
Access Time
8us
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
SPI, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
7.5KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
17
Oscillator Type
Internal
Package Quantity
26
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
384B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908GR8CDW Datasheet
Download the complete datasheet for NXP MC68HC908GR8CDW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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