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Technical Specifications
NXP MC68HC908GZ60CFU technical specifications.
General
Access Time
8us
Package/Case
QFP
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
SPI, CAN, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
53
Oscillator Type
Internal
Package Quantity
84
Packaging
Tray
Peripherals
POR, PWM, LVD
RAM Size
2048B
RoHS Compliant
Yes
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC68HC908GZ60CFU Datasheet
Download the complete datasheet for NXP MC68HC908GZ60CFU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.