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Technical Specifications
NXP MC68HC908LB8CPE technical specifications.
General
Access Time
8us
Package/Case
DIP
Core Architecture
HC08
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
18
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM
RoHS Compliant
Yes
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC68HC908LB8CPE Datasheet
Download the complete datasheet for NXP MC68HC908LB8CPE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.