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Technical Specifications
NXP MC68HC908MR8CP technical specifications.
General
Access Time
8us
Package/Case
DIP
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
12
Oscillator Type
Internal
Package Quantity
13
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
256B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908MR8CP Datasheet
Download the complete datasheet for NXP MC68HC908MR8CP to view detailed technical specifications.
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