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Technical Specifications
NXP MC850DECVR50BUR2 technical specifications.
General
| Package/Case | BGA |
| Data Bus Width | 32b |
| Halogen Free | Not Halogen Free |
| Lead Free | Contains Lead |
| Max Frequency | 50MHz |
| Max Operating Temperature | 95°C |
| Min Operating Temperature | -40°C |
| Number of Cores | 1 |
| Operating Supply Voltage | 3.3V |
| Package Quantity | 500 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RAM Size | 8KB |
| RoHS Compliant | Yes |
| Series | MPC8xx |
| Weight | 0.058659oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC850DECVR50BUR2 Datasheet
Download the complete datasheet for NXP MC850DECVR50BUR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.