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Technical Specifications
NXP MC908AS60ACFN technical specifications.
General
Access Time
8.4us
Package/Case
LCC
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
SPI, CAN, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
42
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
2048B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC908AS60ACFN Datasheet
Download the complete datasheet for NXP MC908AS60ACFN to view detailed technical specifications.
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