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Technical Specifications
NXP MC908GP32CFBR2 technical specifications.
General
Access Time
8us
Package/Case
QFP
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
SPI, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
33
Oscillator Type
Internal
Package Quantity
1
Packaging
Cut Tape
Peripherals
POR, PWM, LVD
RAM Size
512B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC908GP32CFBR2 Datasheet
Download the complete datasheet for NXP MC908GP32CFBR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.