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Technical Specifications
NXP MC9328MX21DVGR2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Lead Shape
Ball
Pin Count
289
PCB
289
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.18
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC9328MX21DVGR2 Datasheet
Download the complete datasheet for NXP MC9328MX21DVGR2 to view detailed technical specifications.
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