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Technical Specifications
NXP MC9S08AW60VFGE technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Frequency
40MHz
Halogen Free
Halogen Free
Interface
I2C, SPI, SCI
Max Operating Temperature
105°C
Max Supply Voltage
5.5V
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Number of I/Os
34
Number of Timers/Counters
2
Oscillator Type
Internal
Package Quantity
160
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
4KB
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08AW60VFGE Datasheet
Download the complete datasheet for NXP MC9S08AW60VFGE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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