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Technical Specifications
NXP MC9S08DN60ACLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, SCI, LIN
Max Operating Temperature
85°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
25
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
2KB
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DN60ACLC Datasheet
Download the complete datasheet for NXP MC9S08DN60ACLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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