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Technical Specifications
NXP MC9S08DV16ACLCR technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, LIN, SCI
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
25
Oscillator Type
External
Packaging
Tape and Reel
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DV16ACLCR Datasheet
Download the complete datasheet for NXP MC9S08DV16ACLCR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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