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Technical Specifications
NXP MC9S08DV60AMLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, SCI, LIN
Lead Free
Lead Free
Max Operating Temperature
125°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
53
Number of Programmable I/O
26
Operating Supply Voltage
5.5V
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
3KB
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DV60AMLC Datasheet
Download the complete datasheet for NXP MC9S08DV60AMLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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