Quick Jump:
Technical Specifications
NXP MC9S08DZ16AMLC technical specifications.
General
Package/Case
LQFP
Core Architecture
HC08
Data Bus Width
8b
Frequency
40MHz
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, SCI
Max Operating Temperature
125°C
Max Supply Voltage
5.5V
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Number of I/Os
12
Number of Programmable I/O
26
Number of Timers/Counters
2
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM, LVD
Radiation Hardening
No
RAM Size
1KB
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DZ16AMLC Datasheet
Download the complete datasheet for NXP MC9S08DZ16AMLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
