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Technical Specifications
NXP MC9S08DZ32AMLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Interface
I2C, SPI, CAN, SCI, LIN
Max Operating Temperature
125°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
25
Number of Programmable I/O
26
Number of Timers/Counters
2
Operating Supply Voltage
5.5V
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD, I2C
Radiation Hardening
No
RAM Size
2KB
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DZ32AMLC Datasheet
Download the complete datasheet for NXP MC9S08DZ32AMLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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