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Technical Specifications
NXP MC9S08DZ32MLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
SPI, SCI, I2C, CAN, LIN
Lead Free
Lead Free
Max Frequency
40MHz
Max Operating Temperature
125°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Min Supply Voltage
2.7V
Number of I/Os
25
Number of Programmable I/O
53
Number of Timers/Counters
6
Oscillator Type
External
Package Quantity
1250
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
RAM Size
2KB
RoHS Compliant
No
Series
S08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S08DZ32MLC Datasheet
Download the complete datasheet for NXP MC9S08DZ32MLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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