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Technical Specifications
NXP MC9S08GB60CFUER technical specifications.
General
| Access Time | 20us |
| Package/Case | LQFP |
| Core Architecture | S08 |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI, SCI |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Memory Size | 60KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 56 |
| Oscillator Type | Internal |
| Packaging | Tape and Reel |
| Peripherals | POR, PWM, WDT, LVD |
| RAM Size | 4096B |
| Series | S08 |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC9S08GB60CFUER Datasheet
Download the complete datasheet for NXP MC9S08GB60CFUER to view detailed technical specifications.
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