PackageLQFP
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Technical Specifications
NXP MC9S08LL8CLH technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Interface
I2C, SPI, SCI
Max Operating Temperature
85°C
Memory Size
10KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
38
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD, LCD
Radiation Hardening
No
RoHS Compliant
No
Series
S08
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MC9S08LL8CLH Datasheet
Download the complete datasheet for NXP MC9S08LL8CLH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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