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Technical Specifications
NXP MC9S08QE4CTGR technical specifications.
General
Package/Case
TSSOP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, SCI, LIN
Max Operating Temperature
85°C
Memory Size
4KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
12
Oscillator Type
Internal
Package Quantity
2500
Packaging
Tape and Reel
Peripherals
PWM, WDT, LVD
Radiation Hardening
No
RAM Size
256B
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08QE4CTGR Datasheet
Download the complete datasheet for NXP MC9S08QE4CTGR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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