Quick Jump:
Technical Specifications
NXP MC9S08QE8CTGR technical specifications.
General
Package/Case
TSSOP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, SCI, LIN
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
12
Number of Timers/Counters
2
Operating Supply Voltage
3.6V
Oscillator Type
Internal
Package Quantity
2500
Packaging
Tape and Reel
Peripherals
PWM, WDT, LVD, I2C
Radiation Hardening
No
RAM Size
512B
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08QE8CTGR Datasheet
Download the complete datasheet for NXP MC9S08QE8CTGR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
