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Technical Specifications
NXP MC9S08RE8FGE technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Interface
SCI
Max Operating Temperature
70°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
0°C
Number of I/Os
39
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
RoHS Compliant
No
Series
S08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S08RE8FGE Datasheet
Download the complete datasheet for NXP MC9S08RE8FGE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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