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Technical Specifications
NXP MC9S12A256BCFU technical specifications.
General
Access Time
25us
Package/Case
QFP
Core Architecture
HCS12
Interface
I2C, SPI, CAN, SCI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
59
Oscillator Type
Internal
Packaging
Tray
Peripherals
PWM, WDT
RAM Size
12288B
RoHS Compliant
Yes
Series
HCS12
Compliance
RoHS
Compliant
Datasheet
NXP MC9S12A256BCFU Datasheet
Download the complete datasheet for NXP MC9S12A256BCFU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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