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Technical Specifications
NXP MC9S12C32MPB25 technical specifications.
General
| Access Time | 25us |
| Package/Case | LQFP |
| Core Architecture | HCS12 |
| Halogen Free | Not Halogen Free |
| Interface | SPI, CAN, SCI, EBI/EMI |
| Lead Free | Contains Lead |
| Max Operating Temperature | 125°C |
| Memory Size | 32KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 35 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| RAM Size | 2048B |
| RoHS Compliant | No |
| Series | HCS12 |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC9S12C32MPB25 Datasheet
Download the complete datasheet for NXP MC9S12C32MPB25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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