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Technical Specifications
NXP MC9S12D64MFU technical specifications.
General
Access Time
25us
Package/Case
QFP
Core Architecture
HCS12
Halogen Free
Not Halogen Free
Interface
I2C, SPI, CAN, SCI
Lead Free
Contains Lead
Max Operating Temperature
125°C
Memory Size
64KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
59
Oscillator Type
Internal
Packaging
Tray
Peripherals
PWM, WDT
RAM Size
4096B
RoHS Compliant
No
Series
HCS12
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S12D64MFU Datasheet
Download the complete datasheet for NXP MC9S12D64MFU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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