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Technical Specifications
NXP MC9S12DG128CPVER technical specifications.
General
Package/Case
LQFP
Core Architecture
HCS12
Data Bus Width
16b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, SCI
Max Frequency
25MHz
Max Operating Temperature
85°C
Memory Size
128KB
Memory Type
EEPROM, FLASH,
Min Operating Temperature
-40°C
Number of I/Os
91
Number of Timers/Counters
1
Operating Supply Voltage
5V
Oscillator Type
Internal
Package Quantity
500
Packaging
Tape and Reel
Peripherals
PWM, WDT
RAM Size
8KB
RoHS Compliant
Yes
Series
HCS12
Weight
0.045091oz
Compliance
RoHS
Compliant
Datasheet
NXP MC9S12DG128CPVER Datasheet
Download the complete datasheet for NXP MC9S12DG128CPVER to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.