Sign in to ask questions about the NXP MC9S12DT256BMPV datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP MC9S12DT256BMPV technical specifications.
| Access Time | 25us |
| Package/Case | LQFP |
| Core Architecture | HCS12 |
| Halogen Free | Not Halogen Free |
| Interface | I2C, SPI, CAN, SCI |
| Lead Free | Contains Lead |
| Max Operating Temperature | 125°C |
| Memory Size | 256KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 91 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | PWM, WDT |
| RAM Size | 12288B |
| RoHS Compliant | No |
| Series | HCS12 |
| RoHS | Not Compliant |
Download the complete datasheet for NXP MC9S12DT256BMPV to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
