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Technical Specifications
NXP MC9S12GC96CPBE technical specifications.
General
| Access Time | 25us |
| Package/Case | LQFP |
| Core Architecture | HCS12 |
| Data Bus Width | 16b |
| Interface | SPI, SCI, EBI/EMI, CAN |
| Lead Free | Lead Free |
| Max Frequency | 25MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 96KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 35 |
| Number of Programmable I/O | 35 |
| Number of Timers/Counters | 8 |
| Oscillator Type | Internal |
| Package Quantity | 160 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| Radiation Hardening | No |
| RAM Size | 4KB |
| RoHS Compliant | Yes |
| Series | HCS12 |
| Watchdog Timer | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC9S12GC96CPBE Datasheet
Download the complete datasheet for NXP MC9S12GC96CPBE to view detailed technical specifications.
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