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Technical Specifications
NXP MC9S12UF32PB technical specifications.
General
Access Time
30us
Package/Case
LQFP
Core Architecture
HCS12
Halogen Free
Not Halogen Free
Interface
USB, SD, SCI, EBI/EMI
Lead Free
Contains Lead
Max Operating Temperature
70°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
0°C
Number of I/Os
41
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, WDT
RAM Size
3584B
RoHS Compliant
No
Series
HCS12
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S12UF32PB Datasheet
Download the complete datasheet for NXP MC9S12UF32PB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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