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Technical Specifications
NXP MCF5207CAG166 technical specifications.
General
Package/Case
LQFP
Core Architecture
Coldfire
Data Bus Width
32b
Frequency
166.67MHz
Halogen Free
Halogen Free
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
166.67MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.3V
Memory Type
ROMless,
Min Supply Voltage
1.4V
Mount
Surface Mount
Number of I/Os
30
Oscillator Type
External
Package Quantity
60
Packaging
Tray
Peripherals
WDT, DMA
Radiation Hardening
No
RoHS Compliant
Yes
Series
MCF520x
Weight
0.04653oz
Compliance
RoHS
Compliant
Datasheet
NXP MCF5207CAG166 Datasheet
Download the complete datasheet for NXP MCF5207CAG166 to view detailed technical specifications.
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