32-bit RISC microprocessor featuring a ColdFire core operating at up to 166.67 MHz. This surface-mount device utilizes a 196-pin MAP-BGA package with a 15mm x 15mm footprint and 1mm pin pitch. Integrated peripherals include 1 I2C, 4 SPI, and 3 UART interfaces, alongside 8KB instruction and 8KB data caches. Supports a wide operating supply voltage range from 1.6V to 3.6V and operates between -40°C and 85°C.
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NXP MCF5208CVM166J technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.16 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | ColdFire MCF5xxx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 166.67MHz |
| Core Architecture | ColdFire |
| Number of CPU Cores | 1 |
| Interface Type | I2C/SPI/UART |
| CAN | 0 |
| UART | 3 |
| USART | 0 |
| I2C | 1 |
| SPI | 4 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.6|1.95|2.75|3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Instruction Cache Size | 8KB |
| Data Cache Size | 8KB |
| Multiply Accumulate | Yes |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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