32-bit RISC microprocessor featuring a ColdFire core operating at up to 166.67 MHz. This surface-mount device utilizes a 196-pin MAP-BGA package with a 15mm x 15mm footprint and 1mm pin pitch. Integrated peripherals include 1 I2C, 4 SPI, and 3 UART interfaces, alongside 8KB instruction and 8KB data caches. Supports a wide operating supply voltage range from 1.6V to 3.6V and operates between -40°C and 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF5208CVM166J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
1.16
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
ColdFire MCF5xxx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
166.67MHz
Core Architecture
ColdFire
Number of CPU Cores
1
Interface Type
I2C/SPI/UART
CAN
0
UART
3
USART
0
I2C
1
SPI
4
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.6|1.95|2.75|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Instruction Cache Size
8KB
Data Cache Size
8KB
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF5208CVM166J Datasheet
Download the complete datasheet for NXP MCF5208CVM166J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.