32-bit RISC microprocessor featuring a 100 MHz ColdFire core. This surface-mount device offers a 256-pin MAP-BGA package with a 1mm pitch and dimensions of 17x17x1.16mm. Integrated peripherals include 1 CAN, 3 UART, 1 I2C, and 1 SPI interface. Operates from 1.6V to 3.6V with an 8KB instruction and 8KB data cache.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF5233CVM100J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.16
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.7748
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
ColdFire MCF5xxx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
100MHz
Number of CPU Cores
1
Interface Type
CAN/I2C/SPI/UART
CAN
1
UART
3
USART
0
I2C
1
SPI
1
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.6|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Instruction Cache Size
8KB
Data Cache Size
8KB
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF5233CVM100J Datasheet
Download the complete datasheet for NXP MCF5233CVM100J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.